室温固化环氧树脂胶黏剂的动态力学性能研究

中南林业科技大学流变力学与材料工程研究所,湖南长沙 410004

室温固化环氧胶粘剂:动态力学性能:温度谱图:频率谱图

Researches on dynamic mechanical properties of room-temperature cured epoxy adhesive
LI Hui, LUO Ying-she, XIE Jian-jun, CHEN Sheng-ming

Institute of Rheological Mechanics and Material Engineering, Central South University of Forestry and Technology, Changsha 410004, Hunan, China

epoxy adhesive cured at room-temperature; dynamic mechanical properties;temperature spectrum; frequency spectrum

备注

以不同用量的同种固化剂和环氧树脂合成的胶黏剂固化体系为研究对象,对其进行了动态力学性能测定与对比分析。结果 表明,固化剂用量不同的两组试样室温完全固化后模量较高,内耗较小。温度扫描测试表明,随固化剂用量增加,环氧树脂胶黏剂的玻璃化转变温度和交联度提高,活化能也相应提高。由两组试样的频率扫描测试结果得到: 50℃下 tan δ变化图形形状大致相同,可通过上下平移得到不同温度的 tan δ图。

The epoxy resin adhesive curing behaviours with different dosage of amine curing agent were compared and analyzed. The experimental results show that there were two groups of sample which completely cured at room temperature, and they had higher modulus and small internal friction than others. The temperature scanning test shows that the vitrification transition temperatures cross-linking degree and of epoxy resin adhesive raised as the curing agent dosage increased, and the activation energy for the curing process also increased. The testing results of frequency scan indicate that the two groups of samples’ tan δ changing curves were approximately same under 50℃ , and so the figures of tan(δ) under different temperatures can be obtained by moving the curves of tan δ up and down.